TM 1-1500-204-23-11
3
Repeat steps 1 and 2 for lower
moldline (LML) surface.
(m) Prepare Temporary Fasteners.
Reduced strength will result if the incorrect
mix ratio is used, if an excessive amount
of air is introduced into the adhesive during
mixing, or if mixing is inadequate and may
result in loss of structural integrity.
DO NOT allow release liquid to come into
Pressure must be applied to adhesive within
contact with repair or repair details. Disbonds
the pot life of the resin. For ambient temper-
may result in loss of structural integrity.
atures in excess of 90 F, decrease this time
by 50%. An unsatisfactory repair will result
Apply release liquid to temporary
1
if the resin gels before adequate pressure is
fasteners in areas that will be in
applied and may result in loss of structural
contact with the splice plate during
integrity. Select and prepare a heat blanket
adhesive cure.
(if required) and all necessary vacuum bag
materials prior to mixing resin.
Cure applied release liquid per
2
manufacturer s instructions.
Prepare adhesive as described in
1
(n) Ensure Proper Fit-Up. Use temporary
fasteners to fasten together the parent
NOTE
skin and splice plate.
Use scrim cloth if required by the system
speciic technical manual.
(o) Mark Splice Plate for Alignment.
2
Apply a thin layer of adhesive on
1
While clamped-up, use a marker
the UML inner surface using a
to mark the splice plate where the
spatula and adhesive comb (where
splice plate extends past the par-
practical) per paragraph 7-6.
ent skin drawing the lines pointing
toward the drilled holes.
3
Apply a thin layer of adhesive on
the splice plate in the area that
While clamped-up, apply lash
2
mates with UML skin. Use a spat-
breaker tape to the part of the
ula and adhesive comb per para-
splice plate which extends past the
parent skin. Trim off any excess
tape.
4
Align the drilled holes of the splice
plate with the drilled holes in the
(p) Repeat step (m) through (o) for LML sur-
parent skin. Fasten with temporary
face.
fasteners.
(q) Prepare mating surfaces of splice
5
Remove excess squeeze out.
plates and UML and LML inner surfaces
for bonding by lightly hand sanding
with 150-180 grit abrasive paper as
described in paragraph 6-7. Handle
Failure to properly cure adhesive in accor-
prepared surfaces wearing powder free
dance with the speciied cure cycle will result in
latex gloves until patch bonding is com-
reduced repair strength may not be detectable
plete. If splice plates are not to be
by visual or nondestructive inspection. This
bonded immediately, cover them and
may result in loss of structural integrity.
the repair area with clean barrier mate-
rial and secure with tape to prevent
6
Allow adhesive to set at room tem-
perature for a minimum of 8 hours.
As an alternate, the adhesive/iller
(r)
Bond Splice Plate to UML Inner Surface
may be set using a heat lamp with
(see igure 7-47, View B).
the cure cycle from the system
speciic technical manual. Operate
heat lamps per paragraph 6-19h.
7-81
