• Home
  • Download PDF
  • Order CD-ROM
  • Order in Print
Figure 7-42. Process Flow Diagram for Skin to Closure Member
Figure 7-43. Skin to Closure Member Disbond Repair

AVUM and AVIM Manual for General Aircraft Maintenance Sheet Metal Shop Volume 11
Page Navigation
  255    256    257    258    259  260  261    262    263    264    265  
img
. . . . . . . . . . . .
TM 1-1500-204-23-11
(2) Skin to Closure Member Disbond and
cause it to exotherm.  Consult the system
Delamination Procedure.
speciic technical manual or engineering for
the proper heating temperature.
(a) Remove dirt, grease and aircraft luids
from repair area as described in para-
(f)
Heat the delaminated/disbonded area
graph 6-5.
using a heat lamp as described in para-
graph 6-19h to the temperature listed
in the system speciic technical manual.
Monitor temperature to ensure the max-
imum temperature limit is not exceeded.
DO NOT use oil or oil based materials
as NDI couplants on advanced composite
components. Use only water or water based
materials. Disbonds may result and loss of
structural integrity may occur.
Reduced strength will result if the incorrect
mix ratio is used, if an excessive amount
(b) Deine the extent of the disbond using
of air is introduced into the adhesive during
NDI according to paragraph 5-2 and the
mixing, or if mixing is inadequate and may
system speciic technical manual. Lay
result in loss of structural integrity.
out the damage as described in para-
graph 6-4.
Pressure must be applied to adhesive within
the pot life of the resin. For ambient temper-
(c) Remove NDI couplant by wiping with
atures in excess of 90 F, decrease this time
clean, water moistened wiping cloth.
by 50%. An unsatisfactory repair will result
if the resin gels before adequate pressure is
(d) Flush the disbond/delamination with
applied and may result in loss of structural
solvent using a hypodermic syringe.
integrity. Select and prepare a heat blanket
Allow solvent to evaporate a minimum
(if required) and all necessary vacuum bag
of 30 minutes.
materials prior to mixing resin.
(e) Dry the repair area as described in para-
NOTE
graph 6-6 for a minimum of 1 hour or as
directed by the system speciic techni-
Refer to paragraph 6-17, Resin Preparation
cal manual, at 150 (10) F using a heat
and Use, for the proper measuring and mixing
lamp or other suitable heat source.
procedures.
(g) Prepare the amount of resin required to
ill the disbond/repair volume. Prepare
the adhesive per paragraph 6-17.
Monitor the repair area temperature to avoid
excessively heating it, as excessive heat can
shorten the pot life of the resin and may
(h) Inject Adhesive (see igure 7-43).
7-70


Privacy Statement
Press Release
Contact

© Copyright Integrated Publishing, Inc.. All Rights Reserved.