TM 1-1270-476-30
2-14
*REMOVAL METHODS
UNCURED COMPOUND
1 -
Cloth moistened with acetone
2 -
Cloth moistened with toluene
3 -
Cloth moistened with trichloroethane
4 -
Cloth moistened with trichloroethylene
5 -
Cloth moistened with isopropyl alcohol
N - Grade N primer
T - Grade T primer
CURED COMPOUND
6 -
Cut away, scrape surface, wipe surface with
toluene
7 -
Soak in dichloromethane
8 -
Wire brush
9 -
Trichloroethane
10 -
Brush or swab with dichloromethane
11 -
Sand or scrape surface, wash surface with
isopropyl alcohol
12 -
Cut away, scrape surface, wipe surface with
acetone
13 -
Cut away, scrape surface, wipe surface with
trichloroethane
14 -
Sand surface with abrasive paper
15 -
Cut away with thermal knife
15
3
Conductive nickel RTV adhesive
50:1 by
weight
4 hr
24
4,11
16
84
Sealing, locking, and retaining
compound, Grade B
N/A
N/A
1-2
1,5,8
17
85
Adhesive-sealant, silicone, RTV,
black
N/A
10-20 min
24
5
18
10
Epoxy adhesive 13085103
10 parts A:
8.5 parts B:
by weight
30-60 min
72
5,11
COMPOUND/ADHESIVE TABLE (cont)
Detailed
Step No.
App
C
Item
No.
Compound Name
Mix Ratio
Base to
Hardener
Max
Work Life
Cure time
at
67 to 87°F
In Hours
Removal*
Methods
