2-6. SEALING COMPOUNDS AND ADHESIVES REMOVAL, APPLICATION, CURING, AND
i. Let compound stand for 30 minutes before
j. Solder leads and remove tags.
k. Clean area with small brush and
l. Clean area by flushing with isopropyl
m. Blow dry with clean dry oil-free air or
Apply compound within 4 hours after cleaning.
n. Apply compound to uncoated area with
Remove excess uncured with trichloroethane,
followed by isopropyl alcohol, then air dry.
o. Have installation inspected with black light.
A second coat may be applied after 3 hours
drying time if needed.
p. Cure compound for 5 days at 67° to 87°F.
END OF TASK